The short and ultrashort pulse lasers from TRUMPF enable microprocessing with an optimal combination of quality, productivity, and profitability, with no limits in terms of industrial suitability. The particular pulse and power stability are achieved through the separation of pulse generation and pulse output. The patented control ensures monitoring of each individual pulse and keeps the power and pulse energy at exactly the right level required for the application. The picosecond and femtosecond lasers of the TruMicro Series 5000 impress with their extremely short pulses and high pulse energy of up to 500 μJ. All of this together with excellent beam quality and high average powers of up to 150 W. This ensures maximum productivity in micro-materials processing. They vaporize virtually every material so quickly that heat influence cannot be detected. They are, therefore, ideal for processing semiconductor materials, metals, dielectrics, plastics, and glasses.
The ultrafast power modulator keeps power and pulse energy at an exact level.
Process temperature-sensitive materials without significant heat input.
TruMicro lasers can be integrated easily and are compatible with all common interfaces.
100% of the average power even in individual pulses as a result of degenerative disk technology
Ultrashort pulse lasers from the TruMicro Series 5000 impress with extremely short pulses of less than 10 ps, as well as high pulse energies of up to 500 μJ. They vaporize virtually every material so quickly that heat influence cannot be detected. The patented two-stage laser power control with an integrated external modulator makes the laser completely stable, from pulse to pulse and across the entire power range. The peak pulse powers are up to 40 MW.
With TruMicro the laser pulse – and therefore the duration of the energy input – is short enough in order to avoid temperature compensation between electrons and their associated atoms. The material evaporates abruptly. The heat does not get into the surrounding material, and thermal stress fractures are avoided. This is referred to as “cold processing”. For metals and many other materials, the ideal pulse duration for this is between 1 – 10 ps.
Laser Community issue 35: New era in beam generation: It will be possible to scan whole bridges, noninvasively inspect huge…Show all news
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